Microelectronics Assembly Books

The following are great reference materials for process engineers and packaging engineers:

  1. Fundamentals of Microsystems Packaging by Rao R. Tummala – This book provides a thorough, comprehensive view of microelectronics packaging. This is a great resource for engineers who are new to microelectronics assembly industry.

    Fundamentals_of_Microsystems_Packaging
    Fundamentals of Microsystems Packaging by Rao R. Tummala
  2. Advanced Wirebond Interconnection Technology by Shankara K. Prasad – This is a “how to” book that provides a complete reference for wire bonding process. This is a great reference material for process engineers who are responsible for, or support, the wire bonding process.

    Advanced_Wirebond_Interconnection_Technology
    Advanced Wirebond Interconnection Technology by Shankara K. Prasad
  3. Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield by George Harman – This book provides a deeper look into the wire bonding process, and is especially useful for failure analyses.

    Wire_Bonding_in_Microelectronics
    Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield by George Harman
  4. Flip Chip Technologies by John H. Lau – This book provides a deeper look into flip chip technologies and is mostly useful for design or packaging engineers.
    Flip_Chip_Technologies
    Flip Chip Technologies by John H. Lau

     

  5. Surface Mount Technology: Principles and Practice by Ray P. Prasad – This book, though not a microelectronics packaging book, provides a comprehensive view of surface mount technologies. This is a good reference material for design engineers and process engineers.

    Surface_Mount_Technology
    Surface Mount Technology: Principles and Practice by Ray P. Prasad
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