About Microelectronics Assembly

Microelectronics assembly refers to a microelectronics device or the processes related to packaging that device.

Typical processes associated with wire bondable die packaged onto a substrate or printed circuit board include: component attach, die attach, wire bonding, sealing or encapsulation.

Typical processes associated with flip chip die packaged onto a substrate or printed circuit board include: component attach, die attach, underfill, lid attach, ball attach.

Advertisements

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s